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专利名称：Method of fabricating ceramic multilayer
substrate
发明人：Satoru Adachi,Junzo Fukuta,Katsuya
Kawakami,Seigo Ooiwa
申请号：US08/8100申请日：19970303公开号：US06042667A公开日：20000328
摘要：A method of fabricating a ceramic multilayer substrate includes steps oflaminating a plurality of green sheets including an inside green sheet formed with aconductor pattern and pressing a laminate of green sheets under a predeterminedpressure together with sheet restricting members applied to opposite surfaces of thelaminate respectively, thereby bonding the laminate and sheet restricting memberstogether, each sheet restricting member having a smaller percent change in thicknessthan the green sheets during the bonding and a higher firing temperature than the greensheets, firing a bonded assemblage of the green sheets and sheet restricting members ata firing temperature of the green sheets, and removing the sheet restricting membersfrom the opposite surfaces of a fired body.
申请人：SUMOTOMO METAL ELECTRONICS DEVICES, INC.
代理机构：Foley & Lardner
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