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专利名称：VERTICALLY INTEGRATED SYSTEMS发明人：Alan J. O'DONNELL,Santiago IRIARTE,Mark J.
MURPHY,Colin G. LYDEN,Gary CASEY,EoinEdward ENGLISH
申请号：US141788申请日：20140225
公开号：US20140175524A1公开日：20140626
专利附图：
摘要：Embodiments of the present invention provide an integrated circuit systemincluding a first active layer fabricated on a front side of a semiconductor die and a
second pre-fabricated layer on a back side of the semiconductor die and having electricalcomponents embodied therein, wherein the electrical components include at least onediscrete passive component. The integrated circuit system also includes at least oneelectrical path coupling the first active layer and the second pre-fabricated layer.
申请人：ANALOG DEVICES, INC.
地址：Norwood MA US
国籍：US
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