TPS54360

www.ti.com

SLVSBB4–AUGUST2012

60VInput,3.5A,StepDownConverterwithEco-mode™

CheckforSamples:TPS54360

FEATURES

•4.5Vto60V(65VAbsMax)InputRange•InternalSoft-Start

•CurrentModeControlConverter•

AccurateCycle-by-CycleCurrentLimit,•92-mΩHigh-SideMOSFET

Thermal,OVP,andFrequencyFoldback•

HighEfficiencyatLightLoadswithaPulseProtection

SkippingEco-mode™

•0.8-V1%InternalVoltageReference•146μAOperatingQuiescentCurrent•8-PinHSOICwithPowerPAD™Package•1μAShutdownCurrent

•–40°Cto150°CTJOperatingRange

•100kHzto2.5MHzFixedSwitchingFrequency•

SupportedbyWEBENCH™SoftwareTool

•SynchronizestoExternalClock

•

AdjustableUVLOVoltageandHysteresis

APPLICATIONS

•

12-V,24-Vand48-VIndustrial,AutomotiveandCommunicationsPowerSystems

DESCRIPTION

TheTPS54360isa60V,3.5A,stepdownregulatorwithanintegratedhighsideMOSFET.Currentmodecontrolprovidessimpleexternalcompensationandflexiblecomponentselection.Alowripplepulseskipmodereducesthenoloadsupplycurrentto146μA.Shutdownsupplycurrentisreducedto1μAwhentheenablepinispulledlow.

Undervoltagelockoutisinternallysetat4.3V,butcanbeincreasedusingtheenablepin.Theoutputvoltagestartuprampisinternallycontrolledtoallowacontrolledstart-upandeliminateovershoot.

Awideswitchingfrequencyrangeallowseitherefficiencyorexternalcomponentsizetobeoptimized.Frequencyfoldbackandthermalshutdownprotectsinternalandexternalcomponentsduringanoverloadcondition.TheTPS54360isavailableinan8-pinthermallyenhancedHSOICPowerPAD™package.SIMPLIFIEDSCHEMATIC

EFFICIENCYvsLOADCURRENT

100

VINVIN90TPS543608070

EN%V -BOOT 60IN= 12VyVcOUTne50iRT/CLKSWcif40fE30R120COMP10

VOUT= 5V, sw = 600 kHzfFBV0OUT= 3.3V, sw = 300 kHzfR30

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

GNDIO- Output Current -A

Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof

TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.

Eco-mode,PowerPAD,WEBENCHaretrademarksofTexasInstruments.

PRODUCTPREVIEWinformationconcernsproductsintheformativeordesignphaseofdevelopment.CharacteristicdataandCopyright©2012,TexasInstrumentsIncorporated

otherspecificationsaredesigngoals.TexasInstrumentsreservestherighttochangeordiscontinuetheseproductswithoutnotice.

PRODUCT󰀀PREVIEWTPS54360

SLVSBB4–AUGUST2012

www.ti.com

ThisintegratedcircuitcanbedamagedbyESD.TexasInstrumentsrecommendsthatallintegratedcircuitsbehandledwithappropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage.

ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemoresusceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications.

Table1.ORDERINGINFORMATION(1)

TJ

–40°Cto150°C

(1)(2)

PACKAGE8PinHSOIC

PARTNUMBER(2)TPS54360DDA

ForthemostcurrentpackageandorderinginformationseethePackageOptionAddendumattheendofthisdocument,orseetheTIwebsiteatwww.ti.com.

TheDDApackageisalsoavailableintapeandreelpackaging.AddanRsuffixtothedevicetype(thatisTPS54360DDAR).

DEVICEINFORMATION

PINCONFIGURATION

HSOICPACKAGE(TOPVIEW)

BOOT

1

8

SW

PRODUCT󰀀PREVIEWVIN2

ThermalPad9

7GND

EN36COMP

RT/CLK45FB

PINFUNCTIONS

PINNAMEBOOTVINEN

NO.123

I/O

DESCRIPTION

AbootstrapcapacitorisrequiredbetweenBOOTandSW.IfthevoltageonthiscapacitorisbelowtheminimumrequiredtooperatethehighsideMOSFET,theoutputisswitchedoffuntilthecapacitorisrefreshed.

Inputsupplyvoltagewith4.5Vto60Voperatingrange.

Enablepin,withinternalpull-upcurrentsource.Pullbelow1.2Vtodisable.Floattoenable.Adjusttheinputundervoltagelockoutwithtworesistors.SeetheEnableandAdjustingUndervoltageLockoutsection.ResistorTimingandExternalClock.Aninternalamplifierholdsthispinatafixedvoltagewhenusinganexternalresistortogroundtosettheswitchingfrequency.IfthepinispulledabovethePLLupperthreshold,amodechangeoccursandthepinbecomesasynchronizationinput.TheinternalamplifierisdisabledandthepinisahighimpedanceclockinputtotheinternalPLL.Ifclockingedgesstop,theinternalamplifierisre-enabledandtheoperatingmodereturnstoresistorfrequencyprogramming.Invertingnodeofthetransconductance(gm)erroramplifier.

Erroramplifieroutputandinputtotheoutputswitchcurrent(PWM)comparator.Connectfrequencycompensationcomponentstothispin.Ground

Thesourceoftheinternalhigh-sidepowerMOSFETandswitchingnodeoftheconverter.

GNDpinmustbeelectricallyconnectedtotheexposedpadontheprintedcircuitboardforproperoperation.

OII

RT/CLK4I

FBCOMPGNDSW

ThermalPad

567

IO–I–

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TPS54360

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SLVSBB4–AUGUST2012

FUNCTIONALBLOCKDIAGRAM

ENVINShutdownThermal EnableShutdownUVLOOVLogicComparatorShutdownShutdownLogicEnableThresholdBoot ChargeVoltageReferenceMinimum ClampBoot UVLOCurrent ERRORPulseSense AMPLIFIERSkip PWMFBComparatorBOOT

LogicShutdown6Slope CompensationCOMP

SW

FrequencyFoldbackReference DAC for Soft-StartMaximum ClampOscillator with PLL8/8/2012 A01927 GND

POWERPADRT\\CLK

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ABSOLUTEMAXIMUMRATINGS(1)

overoperatingfree-airtemperaturerange(unlessotherwisenoted)

VALUE

MIN

VINEN

Inputvoltage

BOOTFBCOMPRT/CLKBOOT-SW

Outputvoltage

SW

SW,10-nsTransient

ElectrostaticDischarge(HBM)QSS009-105(JESD22-A114A)ElectrostaticDischarge(CDM)QSS009-147(JESD22-C101B.01)OperatingjunctiontemperatureStoragetemperature(1)

–0.6–2–0.3–0.3–0.3–0.3–0.3

MAX658.473333.6865652500–40to150–65to150

kVV°C°CVVUNIT

Stressesbeyondthoselistedunderabsolutemaximumratingsmaycausepermanentdamagetothedevice.Thesearestressratingsonlyandfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderrecommendedoperatingconditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability.

PRODUCT󰀀PREVIEWTHERMALINFORMATION

THERMALMETRIC(1)(2)

θJAψJTψJBθJCtopθJCbotθJB(1)(2)

Junction-to-ambientthermalresistance(standardboard)Junction-to-topcharacterizationparameterJunction-to-boardcharacterizationparameterJunction-to-case(top)thermalresistanceJunction-to-case(bottom)thermalresistanceJunction-to-boardthermalresistance

TPS54360DDA(8PINS)

42.05.923.445.83.623.4

°C/WUNITS

Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953.PowerratingataspecificambienttemperatureTAshouldbedeterminedwithajunctiontemperatureof150°C.Thisisthepointwheredistortionstartstosubstantiallyincrease.Seepowerdissipationestimateinapplicationsectionofthisdatasheetformoreinformation.

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SLVSBB4–AUGUST2012

ELECTRICALCHARACTERISTICS

TJ=–40°Cto150°C,VIN=4.5to60V(unlessotherwisenoted)

PARAMETER

TESTCONDITIONS

MIN

TYP

MAX

UNIT

SUPPLYVOLTAGE(VINPIN)

Operatinginputvoltage

4.560VInternalundervoltagelockoutthresholdRising

4.1

4.34.48

VInternalundervoltagelockoutthresholdhysteresis

325mVShutdownsupplycurrent

EN=0V,25°C,4.5V≤VIN≤60V1.33.5Operating:nonswitchingsupplycurrent

FB=0.83V,TA=25°C146

175μA

ENABLEANDUVLO(ENPIN)

EnablethresholdvoltageNovoltagehysteresis,risingandfalling1.1

1.21.3

VInputcurrentEnablethreshold+50mV–4.6Enablethreshold–50mV

–0.58–1.2-1.8μAHysteresiscurrent

–2.2–3.4

-4.5μA

INTERNALSOFT-STARTTIME

Soft-StartTimefSW=500kHz,10%to90%1.5msSoft-StartTime

fSW=2.5MHz,10%to90%

0.42msVOLTAGEREFERENCEVoltagereference

0.792

0.8

0.808

V

HIGH-SIDEMOSFET

On-resistance

VIN=12V,BOOT-SW=6V

92

190

mΩ

ERRORAMPLIFIER

Inputcurrent

50nAErroramplifiertransconductance(gM)

–2μA350μMhosErroramplifiertransconductance(gM)during

soft-start

–2μA77μMhosErroramplifierdcgainVFB=0.8V

10,000V/VMinunitygainbandwidth2500kHzErroramplifiersource/sink

V(COMP)=1V,100mVoverdrive±30μACOMPtoSWcurrenttransconductance

12

A/V

CURRENTLIMIT

AllVINandtemperatures,OpenLoop

4.55.56.8CurrentlimitthresholdAlltemperatures,VIN=12V,OpenLoop4.55.56.25A

VIN=12V,TA=25°C,OpenLoop

5.2

5.55.85

Currentlimitthresholddelay

60

nsTHERMALSHUTDOWN

Thermalshutdown

176°CThermalshutdownhysteresis

12

°C

TIMINGRESISTORANDEXTERNALCLOCK(RT/CLKPIN)

SwitchingfrequencyrangeusingRTmode

1002500kHzfSW

Switchingfrequency

RT=200kΩ

450500

550kHzSwitchingfrequencyrangeusingCLKmode160

2300

kHzMinimumCLKinputpulsewidth15nsRT/CLKhighthreshold1.551.7

VRT/CLKlowthreshold

0.5

1.2VRT/CLKfallingedgetoSWrisingedgedelay

Measuredat500kHzwithRTresistorinseries55nsPLLlockintime

Measuredat500kHz

78

μs

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PRODUCT󰀀PREVIEWPACKAGE OPTION ADDENDUM

www.ti.com

15-Aug-2012

PACKAGING INFORMATION

Orderable DeviceTPS54360DDATPS54360DDAR

(1)

Status

(1)

Package TypePackage

Drawing

DDADDA

Pins88

Package Qty

752500

Eco Plan

TBDTBD

(2)

Lead/Ball FinishCall TICall TI

MSL Peak Temp Call TICall TI

(3)

Samples(Requires Login)

PREVIEWSO PowerPADPREVIEWSO PowerPAD

The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms \"Lead-Free\" or \"Pb-Free\" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines \"Green\" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

15-Aug-2012

PACKAGING INFORMATION

Orderable DeviceTPS54360DDATPS54360DDAR

(1)

Status

(1)

Package TypePackage

Drawing

DDADDA

Pins88

Package Qty

752500

Eco Plan

TBDTBD

(2)

Lead/Ball FinishCall TICall TI

MSL Peak Temp Call TICall TI

(3)

Samples(Requires Login)

PREVIEWSO PowerPADPREVIEWSO PowerPAD

The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms \"Lead-Free\" or \"Pb-Free\" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines \"Green\" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

IMPORTANTNOTICE

TexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,enhancements,improvementsandotherchangestoitssemiconductorproductsandservicesperJESD46CandtodiscontinueanyproductorserviceperJESD48B.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentandcomplete.All

semiconductorproducts(alsoreferredtohereinas“components”)aresoldsubjecttoTI’stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment.

TIwarrantsperformanceofitscomponentstothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’stermsandconditionsofsaleofsemiconductorproducts.TestingandotherqualitycontroltechniquesareusedtotheextentTIdeemsnecessarytosupportthiswarranty.Exceptwheremandatedbyapplicablelaw,testingofallparametersofeachcomponentisnotnecessarilyperformed.

TIassumesnoliabilityforapplicationsassistanceorthedesignofBuyers’products.BuyersareresponsiblefortheirproductsandapplicationsusingTIcomponents.TominimizetherisksassociatedwithBuyers’productsandapplications,Buyersshouldprovideadequatedesignandoperatingsafeguards.

TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orotherintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIcomponentsorservicesareused.InformationpublishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensetousesuchproductsorservicesorawarrantyorendorsementthereof.Useofsuchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectualpropertyofthethirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI.

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Buyeracknowledgesandagreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryandsafety-relatedrequirements

concerningitsproducts,andanyuseofTIcomponentsinitsapplications,notwithstandinganyapplications-relatedinformationorsupportthatmaybeprovidedbyTI.Buyerrepresentsandagreesthatithasallthenecessaryexpertisetocreateandimplementsafeguardswhichanticipatedangerousconsequencesoffailures,monitorfailuresandtheirconsequences,lessenthelikelihoodoffailuresthatmightcauseharmandtakeappropriateremedialactions.BuyerwillfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuseofanyTIcomponentsinsafety-criticalapplications.

Insomecases,TIcomponentsmaybepromotedspecificallytofacilitatesafety-relatedapplications.Withsuchcomponents,TI’sgoalistohelpenablecustomerstodesignandcreatetheirownend-productsolutionsthatmeetapplicablefunctionalsafetystandardsandrequirements.Nonetheless,suchcomponentsaresubjecttotheseterms.

NoTIcomponentsareauthorizedforuseinFDAClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersofthepartieshaveexecutedaspecialagreementspecificallygoverningsuchuse.

OnlythoseTIcomponentswhichTIhasspecificallydesignatedasmilitarygradeor“enhancedplastic”aredesignedandintendedforuseinmilitary/aerospaceapplicationsorenvironments.BuyeracknowledgesandagreesthatanymilitaryoraerospaceuseofTIcomponentswhichhavenotbeensodesignatedissolelyattheBuyer'srisk,andthatBuyerissolelyresponsibleforcompliancewithalllegalandregulatoryrequirementsinconnectionwithsuchuse.

TIhasspecificallydesignatedcertaincomponentswhichmeetISO/TS16949requirements,mainlyforautomotiveuse.Componentswhichhavenotbeensodesignatedareneitherdesignednorintendedforautomotiveuse;andTIwillnotberesponsibleforanyfailureofsuchcomponentstomeetsuchrequirements.ProductsAudioAmplifiersDataConvertersDLP®ProductsDSP

ClocksandTimersInterfaceLogicPowerMgmtMicrocontrollersRFID

OMAPMobileProcessorsWirelessConnectivity

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Applications

AutomotiveandTransportationwww.ti.com/automotiveCommunicationsandTelecomwww.ti.com/communicationsComputersandPeripheralsConsumerElectronicsEnergyandLightingIndustrialMedicalSecurity

Space,AvionicsandDefenseVideoandImaging

www.ti.com/computerswww.ti.com/consumer-appswww.ti.com/energywww.ti.com/industrialwww.ti.com/medicalwww.ti.com/security

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