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专利名称：Ground contact of an integrated circuit
testing apparatus
发明人：Foong Wei Kuong,Goh Kok Sing,Shamal
Mundiyath
申请号：US13848209申请日：20130321公开号：US09658248B2公开日：20170523
专利附图：
摘要：A ground electrical contact for an integrated circuit (IC) testing apparatus thatcomprises: a rigid bottom member having two planar surfaces that slope towards each
other, so that the bottom member forms a partial wedge shape with the top end of thewedge being narrower than the bottom end; a flexible top member having two armsextending over said bottom member such that the top member forms an inverted U-shape, said two arms having an inwards bias such that an inner surface of each arm ispressed in contact with each planar surface; and a compressible member locatedbetween the narrower end of said bottom member and a bifurcation inner surface, whichis an inner surface where the two arms bifurcate in the top member. The bottom memberand top member are made of an electrically conductive material.
申请人：JF Microtechnology Sdn. Bhd.
地址：Petaling Jaya, Selangor MY
国籍：MY
代理机构：Maschoff Brennan
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