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专利名称：Method and apparatus for inspecting a chip
prior to bonding
发明人：Schuster, Johannes申请号：EP09167663.5申请日：20090811公开号：EP2284863B1公开日：20120404
摘要：The invention pertains to the field of automation technology and relates to anapparatus and a method for handling chips, in particular semiconductor dies. A chiphandling tool is configured to receive a chip, in particular a semiconductor die, at atakeover location and to hand over said chip to a delivery location, and comprises a worksurface configured to be brought into connection with a first surface on a first side of thechip. The chip handling tool further comprises illumination means for illuminating the chipfrom its first side while said first side of the chip is in connection with the work surface. Achip handling process is also presented.
申请人：KULICKE & SOFFA DIE BONDING GMBH
地址：CH
国籍：CH
代理机构：Körner, Thomas Ottmar
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