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专利名称：Power electronic system with passive
cooling
发明人：Gary E. Oberlin,Bruce A. Myers,Thomas A.
Degenkolb,Darrel E. Peugh
申请号：US10694191申请日：20031027公开号：US07106588B2公开日：20060912
专利附图：
摘要：The present invention relates to an apparatus and method for dissipating heatfrom high-power electronic devices. The assembly includes a high-current substrate, such
as a printed circuit board supporting an electronic device, a heat pipe thermally coupledwith the electronic device and an assembly case which also forms a heat sink, and thermaltransient suppression material which may be thermally coupled with the electronic deviceand the heat pipe.
申请人：Gary E. Oberlin,Bruce A. Myers,Thomas A. Degenkolb,Darrel E. Peugh
地址：Windfall IN US,Kokomo IN US,Noblesville IN US,Kokomo IN US
国籍：US,US,US,US
代理人：Jimmy L. Funke
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